Huawei has just unveiled the world's first dual-hinged, triple-screen foldable smartphone with the introduction of the new Mate XT Ultimate Design... a new tri-foldable smartphone that starts from $2800. Check it out:
September 11, 2024
huawei
Only by living, there is hope: Interpreting SMIC under "Export Control".
September 30, 2020
IC
CPU/GPU performance will double in the next 10 years.
September 29, 2020
GPU
The basic composition and characteristics of fiber laser cutting machine laser.
September 28, 2020
laser
RAID principle _ the advantages and disadvantages of different levels of RAID.
September 25, 2020
RAID
ADI cooperates with Microsoft to mass produce advanced 3D imaging products and solutions.
September 24, 2020
ADI
Many people can't get started when learning MCU, so how can they get started quickly?
September 23, 2020
MCU
Methods to reduce transients and EMI noise in switching applications.
September 22, 2020
EMI
What will the storage technology of the future look like? For the traditional Flash technology based on NVMe, we should continue to expect higher capacity. For example, what will appear after QLC NAND technology? Only time will tell us the answer. The next-generation NVMe specification will introduce protocol standards that span more PCI Express channels and higher bandwidth. As storage technology continues to develop, storage technology plugged into computers will also develop.
September 21, 2020
Memory
What are the characteristics of 8051 single-chip microcomputer? What are the control bus signals of 8051 single-chip microcomputer?
September 18, 2020
8051
ADI: VCO that drives the high-voltage phase-locked loop frequency synthesizer circuit. Author: Thomas Brand, ADI Field Applications Engineer.
September 17, 2020
VCO
Modern consumers are more enthusiastic about pursuing and accepting new technologies than ever before. As devices such as smartphones, smart watches, tablets and wearable fitness bracelets are updated, their performance expectations for each new generation of new products will also increase. They not only demand enhanced functions, but also expect devices to become smaller, faster, and run longer than previous generation products. Although this strong desire for the latest products promotes the business development of technology companies, it also poses challenges to the engineers responsible for new designs. In order to create high-density circuits and increase runtime, efficiency must also increase. However, as the electronic components in the design become more compact and densely packed, it becomes more and more important not to cut corners on electromagnetic interference (EMI) related issues.
September 16, 2020
EMI
The method of identifying whether flash is SLC or MLC flash.
September 15, 2020
slc|MLC|FlaSh
One article knows the difference and connection between EMC/EMI and EMS.
September 14, 2020
EMC|EMI
The flash memory architecture includes a storage array stacked with a large number of flash memory cells. The basic flash memory cell consists of a memory transistor with a control gate and a floating gate. The floating gate is insulated from the rest of the transistor by a thin dielectric material or oxide layer. The floating gate stores charge and controls current.
September 11, 2020
Flash memory
First look carefully, EPROM and EEPROM are different.
September 10, 2020
EEPROM|MEMORY
Guowei Sierxin released a 300 million gate prototype verification system, using the industry's highest capacity Intel® Stratix® 10 GX 10M FPGAs. The Quad 10M Prodigy™ Logic System expands its capacity leadership and simplifies the complex SoC/ASIC design and verification process.
September 09, 2020
ASIC|FPGA|DSP
In PCB design, there are many places that need to consider the safety distance. Here, it is classified into two categories for the time being: one is electrical-related safety spacing, and the other is non-electrical-related safety spacing.
September 08, 2020
PCB|Electric
Seven challenges faced by traditional storage.
September 07, 2020
Memory
This design example implements a remote sensor preamplifier (such as for piezoelectric sensors) that can transmit signals and power through a single wire pair or coaxial cable.
September 04, 2020
Operational amplifier|Noise|Sensor
On October 29, 2018, Fujian Jinhua was included in the list of export control entities by the United States and announced restrictions on the export of US products such as semiconductor manufacturing equipment to Jinhua. This incident is regarded as the beginning of the United States to fully suppress China’s semiconductor industry; August 2020 On the 7th, Huawei Yu Chengdong sadly announced that HiSilicon Kirin high-end chips could not be manufactured after September 15, and it would become a swan song.
September 03, 2020
Chip|Intel|Wafer
Huawei Unleashes Mate XT Ultimate Design - World's First Tri-Fold Smartphone
Scalable Graphene Technology - The Latest Battery Safety and Performance Solutions
Mediatek Is About To Release This Year’s Blockbuster Dimensity 9400 Flagship Chip
Lithium CR1620 Battery Equivalent
Integrated Circuit Codes and IC Code List
What is an Integrated Circuit? [Definition, Function, Diagram & Types]
PNP Transistor Symbol, Working, Function and Example
Transistor NPN vs PNP: Difference Between PNP and NPN Transistor
![What is an Integrated Circuit? [Definition, Function, Diagram & Types]](/files/uploads/blog/20240226/integrated-circuits-definition-and-meaning.png)
