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ADI cooperates with Microsoft to mass produce advanced 3D imaging products and solutions.

September 24, 2020

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China, Beijing-Analog Devices, Inc. (Nasdaq: ADI) announced a strategic cooperation with Microsoft Corp. to use Microsoft’s 3D time-of-flight (ToF) sensor technology to allow customers to easily create high-performance 3D applications and achieve higher Depth accuracy without being restricted by specific environmental conditions. Based on Microsoft Azure Kinect technology, ADI will provide leading ToF solutions for a wide range of audiences in the fields of Industry 4.0, automotive, gaming, augmented reality, computational photography and videography.

At present, the industrial market is promoting the development of 3D imaging systems, which can be used in harsh environments that require advanced applications such as human-machine collaborative robots, room mapping and inventory management systems to achieve Industry 4.0. In addition, ToF can also implement occupant detection and driver monitoring functions in automotive applications, providing drivers and passengers with a safer car driving experience.


Duncan Bosworth, General Manager of ADI's Consumer Electronics Division, said: "Our customers want deep image capture to be used directly and as simple as taking pictures. Both the HoloLens mixed reality headset and Azure Kinect development kit use Microsoft's ToF 3D sensor technology , This technology is regarded as the industry standard in the field of time-of-flight technology. Combining this technology with ADI's self-built solutions, our customers can easily develop and expand the next generation of high-performance applications they need, ready to use. "


ADI is designing, producing and selling a new product series, including 3D ToF imager, laser driver, depth system based on software and hardware, these products will provide the outstanding depth resolution on the market, the precision can reach millimeter level. ADI will build a complete system around complementary metal oxide semiconductor (CMOS) imaging sensors to provide 3D details with better 3D details, longer operating distances, and more reliable imaging without being restricted by targets within the line of sight. This platform provides customers with plug-and-play functionality to quickly achieve large-scale deployment.


Microsoft Partner Hardware Architect Cyrus Bamji said: "ADI is a leader in the field of transforming physical phenomena into digital information. This cooperation can expand the market penetration of our ToF sensor technology and help commercial 3D sensors, cameras and related The development of solutions that are compatible with the Microsoft ecosystem built on the Microsoft depth, Intelligent Cloud and Intelligent Edge platforms."


ToF 3D sensor technology can accurately project controlled lasers that last only a few nanoseconds. These lasers are then reflected from the scene to the high-resolution image sensor, which can give a depth estimate for each pixel in this image matrix. ADI's newly launched CMOS ToF product is based on Microsoft's technology to achieve highly accurate depth measurement. It is a calibration solution with low noise, high stability against multipath interference, and easy mass production. ADI's products and solutions have begun to provide samples, and it is expected that the first 3D imaging products using Microsoft technology will be released by the end of 2020.