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Blogs

  • YMTC announced the successful development of 128-layer 3D NAND Flash chip series.

    YMTC announced the successful development of 128-layer 3D NAND Flash chip series.
    On October 29, 2018, Fujian Jinhua was included in the list of export control entities by the United States and announced restrictions on the export of US products such as semiconductor manufacturing equipment to Jinhua. This incident is regarded as the beginning of the United States to fully suppress China’s semiconductor industry; August 2020 On the 7th, Huawei Yu Chengdong sadly announced that HiSilicon Kirin high-end chips could not be manufactured after September 15, and it would become a swan song.
    September 3, 2020
  • 7nm wafers are coming! Samsung mass production 7LPP EUV process

    7nm wafers are coming! Samsung mass production 7LPP EUV process
    Following TSMC's first 7+ nanochips using EUV lithography at the beginning of this month, Samsung also announced that it will release and gradually produce a variety of 7nm (UV) EUV chips. In order to catch up with TSMC's ecosystem, Samsung will also support its IP and EDA infrastructure and detail its packaging capabilities.
    October 19, 2018

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