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This article explains the structure of MCP memory in detail.

October 20, 2020


1. MCP memory

The current concept of MCP is given as follows: MCP is to vertically stack various types of memory or non-memory chips of different sizes in a plastic package shell. It is a hybrid technology of a single package. This method saves small printed circuit boards. PCB space. The complexity of the chips used in MCP is relatively low, and there is no need for high air tightness and strict mechanical impact test requirements. When high-density packaging is used in a limited PCB area, MCP becomes the first choice. After recent technological changes, it has achieved more High packing density. At present, MCP generally has built-in 3-9 layers of vertically stacked memory. An MCP device can include non-NOR, or non-NAND structured flash memory and other structure SRAM chip layers for mobile phone memory. If there is no high-efficiency space ratio MCP , It is almost impossible to achieve multi-functionality in high-end mobile phones. MCP continues to enable new package designs to be successfully used in actual production. The chips are integrated through stacked packaging to achieve higher performance density, better integration, lower power consumption, greater flexibility, and lower cost. At present, the mass production of mobile phone memory chip packaging Mainly, develop applications in digital cameras, PDAs and certain notebook computer products.


Multi-chip packaging (MCP) technology can integrate FLASH, DRAM and other chips with different specifications into a single chip using system packaging. It has short production time, low manufacturing cost, and has the advantages of low power consumption and high data transmission rate. It is already portable The most important specifications of electronic products with built-in memory products. In addition, digital TVs, set-top boxes, network communication products, etc. have also begun to adopt various MCP products.

Application development:

Integrated circuit packaging technology has been following the development of chips, and the packaging density has continued to increase. It has expanded from single-chip packaging to multi-chip packaging. A different approach to innovation.

The typical division of mobile phone devices includes digital baseband processor, analog baseband, memory, radio frequency and power chip. Non-volatile flash memory that does not lose data after power failure has been widely used in mobile phone memory due to its advantages of electrical erasing, micro power consumption, large capacity, and small size. Each type of mobile phone emphasizes having different functions than other models, which makes it require a specific memory. The increasingly popular multifunctional high-end mobile phones require the support of larger capacity and more types of high-speed memory subsystems.

The MCP packaged with integrated static random access memory (SRAM) and flash memory was developed first to meet the low power consumption and high-density capacity application requirements of 2.5G and 3G high-end mobile phone memories. It is also the building block for flash memory to achieve various innovations. Piece. In the international market, shipments of mobile phone memory MCP have more than doubled, and manufacturers’ revenue has almost tripled. Some large suppliers in the wireless storage market account for 90% of MCP shipments, and packaging technology and chip process integration go hand in hand.

MCP key technology semiconductor wafer back-end process technology accelerates development, allowing certain and certain types of chips to be integrated in a single first-level package in an appropriate structure. The structure is divided into pyramid type and cantilever type stacking. The former The characteristic is that the chip size is getting smaller and smaller from the bottom up, and the latter is the same size as the stacked chip. MCP is becoming more and more customized and can provide customers with unique application solutions. It has higher efficiency than single chip packaging. Its importance is increasing rapidly. The key processes involved include how to ensure product qualification rate and reduce chip thickness. If it is the same chip stack assembly and dense wire bonding technology.

Two, memory card

A memory card (MemoryCard) is an IC card that uses electrically erasable programmable read-only memory (EEPROM) as its core and can be reused many times. Without any encryption protection measures, the data on the card can be rewritten arbitrarily, and it does not have the function of keeping the data in the card confidential. This kind of card is generally only used for data storage and does not have the function of data confidentiality. It is used in applications such as outdoor parking lots and laundry rooms. The advantages of this type of card are low price and simple manufacturing.

Because the most important application characteristic of IC card is as a carrier of electronic information. Therefore, the application characteristics of various IC cards are mainly reflected in the types of IC card memory, the size of the memory capacity and the additional control functions of the card circuit.

The memory types used in IC cards are mainly divided into two categories: volatile memory and non-volatile memory.

Volatile memory: refers to the memory (such as RAM random access memory) whose data disappears immediately after the power is turned off. This kind of memory is characterized by generally adopting CMOS technology to reduce power consumption. And the data is transmitted in parallel, so it has the ability to access data at high speed. The use of this kind of memory is: either only as a data temporary memory, not storing fixed data or data that needs to be stored for a long time. Either add a battery to keep the memory always in a charged state (may be a working state or a sleep state) to keep the data in the memory not easy to lose.

Non-volatile memory: refers to memory that has the ability to retain data regardless of whether the power supply is turned off.

Since the data retention does not depend on the support of the battery, most of the passive IC cards use this type of memory. The IC cards of non-volatile memory can be divided into the following types:

(1) Mask read-only type: ROM type (ReadOnlyMemory).

(2) One-time programmable read-only type: OTPROM type (OneTImeProgrammableROM).

(3) One-time rewrite type or counting type: The internal structure of this IC card is to provide a certain number of counting units.

(4) Erasable read-only type: EPROM (ErasablePROM).

(5) Electrically erasable type: EEPROM (ElectronicallyErasablePROM).

(6) Mixed type.