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The 7.0-magnitude earthquake in the Philippines may affect the production capacity of many MLCC and packaging and testing manufacturers

  • July 29, 2022
  • 759

According to Xinhua News Agency, a magnitude 7 earthquake struck Abra Province in the northern Luzon Island of the Philippines on the morning of the 27th, and no casualties have been reported so far. According to the information released by the Philippine Institute of Volcanology and Seismology, the earthquake occurred at 8:43 local time (8:43 Beijing time), the epicenter was about 3 kilometers northwest of Tayum Town, Abra Province, and the focal depth was 17 kilometers. The quake was felt in many parts of Luzon Island, including the capital Manila.

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The Philippines is one of the main production bases for passive components (especially MLCCs) in the world. Murata, Samsung Electro-Mechanics, and Taiyo Yuden, the world's top three MLCC manufacturers, have all set up factories in the Philippines. In addition to MLCC, there are many packaging and testing manufacturers in Luzon, the Philippines, and the impact of subsequent production capacity is currently difficult to predict.


Most electronics companies in the Philippines are Japanese companies. Japan accounted for one-fifth of global semiconductor supply in 2010, and Japan-based companies produced $63.3 billion in microchips, accounting for 20.8 percent of the global market, according to SEIPI data. There are also many international semiconductor original factories with factories in Luzon, Philippines, such as Nexperia, Intel, Texas Instruments, Amkor and so on.


ON Semiconductor has 3 packaging and testing plants in the Philippines, each of which is responsible for basically different projects. Among them, the packaging and testing factory in Carmona is mainly responsible for the packaging and logic/analog device testing, ASIC/ASSP testing of surface mount ICs; the factory in Tara City is responsible for SSOP, TSSOP, HSOP, HSSOP, QIP, QFP , SDIP, HDIP, QFN type packaging; Cebu factory is responsible for PQFN clip, PQFN line, WLCSP, SOSM packaging, which is the original Fairchild factory.


Microchip's power devices are packaged and tested by two factories in the Philippines.


ADI has packaging and testing facilities in Malaysia and the Philippines. The packaging and testing plant in Penang, Malaysia was acquired from the acquisition of Linear, and it is responsible for less production capacity. The packaging and testing plant in the Philippines is located in Cavite and is the main packaging and testing center.


Nexperia has a packaging and testing plant in Dongguan, Seremban in Malaysia, and Cabuyo in the Philippines. The Philippine packaging and testing plant focuses on power packaging technology and can process about 1 billion pieces per year (TO-220, DPAK, D2PAK, LFPAK).


ST has six packaging and testing plants, three of which are in Morocco. The rest are in Shenzhen, the Philippines, and Malaysia.


TI has a packaging and testing plant in Chengdu, Taiwan, the Philippines, and Malaysia. The production capacity of the Philippines plant accounts for 40% of TI's total output.


LittleFuse has 3 (one under construction) factories in the Philippines. Mainly responsible for the assembly and test operations of sensors, protection circuits, and power semiconductor modules.


ROHM has 17 factories around the world, including 2 in the Philippines. Roma's two factories in the Philippines are both responsible for the manufacture of Roma's ICs, resistors, capacitors, and transistors, and are the main packaging producers of single ICs.


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