In the memory chip market dominated by the us, Japan and South Korea, there is finally a Chinese company that can compete head-on with the big international players.According to the report, in the first quarter of this year, YMTC, a subsidiary of UNIS, started to put into production 64 layers of stack 3D flash memory with 256Gb capacity and TLC chip, with an initial capacity of only 5,000 pieces per month
According to the latest news, the 64-layer 3D flash memory chip stored by YMTC will increase its monthly production capacity to 60,000 pieces by the end of the year.
However, Cheng Weihua, vice President of CTO of YMTC, said in an interview that he could not give details of the data, including plans for the next generation of more advanced products.
According to the report,YMTC is expected to put 128-layer stack 3D flash memory into production as early as next year, possibly using the second-generation Xtacking architecture
In addition, Cheng Weihua mentioned magnetoresistive memory and phase-change memory technologies, which are considered to be the core of building non-volatile memory in the future, when attending a recent BBS on integrated circuits
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