Datasheets Replacement Solutions
RFQ / BOM 0 Sign In / Register

Select Your Location

M9-CSP64216T9NCBGA13FH

compact system-in-package (SiP) module

M9-CSP64216T9NCBGA13FH
  • M9-CSP64216T9NCBGA13FH
  • play
    product video

Images are for reference only.
See Product Specifications for product details.

Social Media

M9-CSP64216T9NCBGA13FH

compact system-in-package (SiP) module

Orders over $200 are eligible for a limited edition Chinese-style gift.

Orders over $200 are eligible for a limited edition Chinese-style gift.

Orders over $1000 qualify for a $30 shipping fee waiver.

Orders surpassing $5000 enjoy waived shipping and transaction fees.

These offers are applicable to both new and existing customers and are valid from January 1st, 2024, to December 31st, 2024.

  • Manufacturer：

    ATI

  • Datasheet：

    M9-CSP64216T9NCBGA13FH datasheet

  • Package/Case：

    BGA

  • Product Category：

    IC Chips

  • RoHS Status：

Submit your quote request now, and we expect to provide a quote within October 06, 2024. Place your order now, and we expect to complete the transaction within October 09, 2024. Ps:Time is according to GMT+8:00.

Delivery：
fedex ups ems dhl other
Payment ：
jcb American express tt discover paypal

Stock：1 PCS

Our commitment is to deliver prompt quotations within 12 hours. For further assistance, please contact us at [email protected].

M9-CSP64216T9NCBGA13FH Product Details

  • High performance: Integrates a quad-core processor with up to 1.8 GHz clock speed, providing high processing power.

  • High memory capacity: Provides up to 4 GB of LPDDR4 memory, ensuring efficient and fast data storage and retrieval.

  • Compact size: Available in a small 14 x 14 x 1.4 mm SiP package, making it suitable for space-constrained designs.

  • Low power consumption: Consumes minimal power, making it suitable for battery-powered applications.

  • Integrated connectivity: Provides integrated Wi-Fi and Bluetooth connectivity, allowing for wireless communication.

  • Comprehensive software support: Supports a wide range of software tools and frameworks, making it easy to develop applications.

Applications

  • Mobile devices

  • Smart home appliances

  • Wearable devices

  • IoT devices

  • Automotive systems

  • Industrial automation and control

Request a quote M9-CSP64216T9NCBGA13FH at censtry.com. All items are new and original with 365 days warranty! The excellent quality and guaranteed services of M9-CSP64216T9NCBGA13FH in stock for sale, check stock quantity and pricing, view product specifications, and order contact us：[email protected].
The price and lead time for M9-CSP64216T9NCBGA13FH depending on the quantity required, please send your request to us, our sales team will provide you price and delivery within 24 hours, we sincerely look forward to cooperating with you.

Direction：

M9-CSP64216T9NCBGA13FH is a compact system-in-package (SiP) module manufactured by Samsung Electronics. It combines a high-performance processor, memory, and other components in a single package, making it suitable for space-constrained designs.

M9-CSP64216T9NCBGA13FH Related Products