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LPC1765FBD100 Image

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See Product Specifications for product details.



NXP Semiconductor
Product Category:
IC Chips
1800 PCS

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Product Parameter

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
New & Original - Factory Package
Order Limit
No Limit for LPC1765FBD100
Delivery Services
Payment Terms
Wire Transfer or Paypal or Western Union or MoneyGram or Credit Card

LPC1765FBD100 Product Details


1. General description

The LPC1766 is an ARM Cortex-M3 based microcontroller for embedded applications  featuring a high level of integration and low power consumption. The ARM Cortex-M3 is a  next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration.

The LPC1766 operates at CPU frequencies of up to 80 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching. 

The peripheral complement of the LPC1766 includes 256 kB of flash memory, 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG interface, 8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP controllers, SPI interface, 3 I2C interfaces, 2-input plus 2-output I2S interface, 8 channel 12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface, 4 general purpose timers, 6-output general purpose PWM, ultra-low power RTC with separate battery supply, and up to 70 general purpose I/O pins.

The LPC1766 is pin-compatible to the LPC2366 ARM7-based microcontroller.

2. Features

ARM Cortex-M3 processor, running at frequencies of up to 80 MHz. A Memory  Protection Unit (MPU) supporting eight regions is included.

ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).

256 kB on-chip flash programmimg memory. Enhanced flash memory accelerator enables high-speed 80 MHz operation with zero wait states.

In-System Programming (ISP) and In-Application Programming (IAP) via on-chip boot loader software.

64 kB on-chip SRAM includes: 32 kB of SRAM on the CPU with local code/data bus for high-performance CPU access.

Two 16 kB SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well as for general purpose CPU instruction and data storage.

Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with the SSP, I2S, UART, the Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, and for memory-to-memory transfers.

Multilayer AHB matrix interconnect provides a separate bus for each AHB master. 

AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and  the USB interface. This interconnect provides communication with no arbitration delays. 

Split APB bus allows high throughput with few stalls between the CPU and DMA.

3. Applications



Industrial networking

Alarm systems

White goods

Motor control

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