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Blogs

  • Intel advanced 3D packaging technology interpretation

    Intel advanced 3D packaging technology interpretation
    As the industry enters the 2020s, advanced packaging will not only be a necessary tool to compensate for the benefits of downsizing processes, but they have the potential to provide a unique advantage to companies with this capability.Many companies are at the forefront of this transformation
    May 19, 2020
  • 3D flash NAND technology change speed technology gap is narrowing

    3D flash NAND technology change speed technology gap is narrowing
    On CES, SK hynix formally announced the 128 stack layer of 4 d (nature or 3 d, 4 d just business name), has been used in their own PCIe hard disk, this is the first six flash memory in the original factory production flash 128 layer stack, is expected to samsung, western digital, will follow up this year 100 layers of flash memory.
    January 13, 2020
  • SK hynix began sampling 128 layers of 3D NAND SSD

    SK hynix began sampling 128 layers of 3D NAND SSD
    SK hynix announced this week that it has started sampling products based on its 128-layer 3D NAND flash memory, which will soon start appearing on end-user devices.A year ago, they launched 96-tier, fifth-generation 3D NAND, but the low price prompted them to cut production, and fourth-generation 72L 3D NAND is still their main flash memory product
    November 26, 2019

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