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  • Super-large merger case, Infineon announced a $10 billion acquisition of Cypress

    Super-large merger case, Infineon announced a $10 billion acquisition of Cypress

    Infineon Technologies AG and Cypress Semiconductor Corp. announced today that they have signed a definitive agreement. Infineon will acquire Cypress for $23.85 per share in cash, with a total corporate value of 9 billion euros ($10 billion).

    June 04, 2019

    Infineon

  • General PCB guidelines for EMC compliance

    General PCB guidelines for EMC compliance

    The PCBs of information products are now high-density boards, usually 4-layer boards. As the density increases, the trend of use is a 6-layer board, which is designed to take into account the balance of performance and area.

    June 04, 2019

  • Intel, Samsung and Micron's next-generation memories are expected to enter the market next year.

    Intel, Samsung and Micron's next-generation memories are expected to enter the market next year.

    Whether it's DRAM or NAND Flash, existing memory solutions face the physical limits of shrinking processes, which means that it will be more difficult to continuously improve performance and reduce costs.

    May 22, 2019

    DRAM|Samsung|Flash

  • Marvell announces the acquisition of Evera Semi, a wholly owned subsidiary of Glic

    Marvell announces the acquisition of Evera Semi, a wholly owned subsidiary of Glic

    Marvell announced today that it has reached a definitive agreement to acquire Avera Semiconductor, an ASIC business of Gexin.

    May 21, 2019

  • ON Semiconductor Introduces Dual Output DC/DC Converter NCP5810

    ON Semiconductor Introduces Dual Output DC/DC Converter NCP5810

    ON Semiconductor has introduced a 2 watt (W) dual output DC-DC converter NCP5810 that provides both positive and negative output voltages. The device's accurate output voltage, high switching frequency and small package make it ideal for powering display drivers for active matrix organic light-emitting diodes (active matrix OLED or AMOLED) panels for emerging display technologies in portable applications.

    May 14, 2019

    ON|DC/DC|Converter

  • How to layout PCB

    How to layout PCB

    Recently, I worked with an intern on a non-inverting configuration OPA191 op amp with a gain of 2V/V, a load of 10kΩ, and a supply voltage of +/-15V. Figure 1 shows the schematic of the design.

    May 13, 2019

    PCB

  • PCBA processing requirements to follow - patch processing plant

    PCBA processing requirements to follow - patch processing plant

    PCBA is the SMT upper part on the PCB empty board, and then through the DIP plug-in manufacturing process, it will involve many fine and complicated process flow and some sensitive components. If the operation is not standardized, it will cause process defects or components. Damage, affecting product quality and increasing processing costs. Therefore, in the PCBA chip processing, it is necessary to comply with the relevant operating rules and operate in strict accordance with the requirements. The following describes the operating rules of PCBA processing

    May 11, 2019

    PCBA

  • Talking about the use of MOS tube

    Talking about the use of MOS tube

    MOS tubes are commonly used in circuits such as power supplies and drivers, the main points are as follows

    May 06, 2019

    MOS tubes|resistance|MOSFET

  • TE Connectivity (TE) Introduces M3200 Pressure Transmitter

    TE Connectivity (TE) Introduces M3200 Pressure Transmitter

    The M3200 pressure transmitter from TEConnectivity (TE), the world's leading connectivity and sensing technology company, uses advanced MicrofusedTM technology. As the newest member of the family of TE pressure transmitters, the M3200 micro-machined silicon piezoresistive strain gages with high-temperature glass and stainless steel diaphragms to create a unique pressure transmitter front end, compared to traditional products. More reliable.

    April 30, 2019

    M3200|TE Connectivity|HVACR systems

  • Nexperia Introduces New Automotive Grade Constant Current LED Driver Delivers 250mA Output Current

    Nexperia Introduces New Automotive Grade Constant Current LED Driver Delivers 250mA Output Current

    Nexperia, the global leader in discrete devices, logic devices and MOSFET devices, has introduced its family of constant current LED drivers, which add eight new AEC-Q101 compliant devices. Low power and medium power LEDs with drive currents up to 250mA. The 16V NCR32xx and 40V NCR42xx series are available in two package styles: space-saving SOT457 (SC-74) and SOT223 (SC-73); the latter provides higher power capacity up to 1,250mW.

    March 26, 2019

    Nexperia|LED driver|MOSFET

  • About AT24C02 chip working principle

    About AT24C02 chip working principle

    The AT24C02 chip is an EEPROM device with an IIC interface. The so-called EEPROM is an electrically erasable programmable read only memory, which is a kind of ROM. It is a read-only memory, that is, power-down can continue to store data, while at the same time can be erased and rewritten under the action of ordinary voltage, which greatly facilitates the development of the single-chip microcomputer, and now many ROMs on the computer Is the EEPROM used.

    March 01, 2019

    AT24C02|EEPROM|ATMEL

  • Microchip Introduces MCP6V51 Zero-Drift Operational Amplifier

    Microchip Introduces MCP6V51 Zero-Drift Operational Amplifier

    Microchip introduced the MCP6V51 zero-drift operational amplifier. The new device provides ultra-high-accuracy measurements while minimizing the effects of higher and higher high-frequency interference by providing a wide operating voltage range and on-chip electromagnetic interference (EMI) filters.

    January 16, 2019

    Microchip|MCP6V51|Amplifier

  • Texas Instruments: Inject more imagination into the next generation of home appliances

    Texas Instruments: Inject more imagination into the next generation of home appliances

    Yuan Tao of Texas Instruments released a blog post titled "Injecting More Imagination for the Next Generation of Home Appliances."

    January 03, 2019

    Texas Instruments|LED|MSP430TM

  • 7nm wafers are coming! Samsung mass production 7LPP EUV process

    7nm wafers are coming! Samsung mass production 7LPP EUV process

    Following TSMC's first 7+ nanochips using EUV lithography at the beginning of this month, Samsung also announced that it will release and gradually produce a variety of 7nm (UV) EUV chips. In order to catch up with TSMC's ecosystem, Samsung will also support its IP and EDA infrastructure and detail its packaging capabilities.

    October 19, 2018

    Samsung|7LPP EUV|7nm EUV wafers