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About no holes are allowed under the components, what is the truth?

Development board
May 5, 2019 by Terry Wells 354

recently made a board, there are requirements to say: no holes are allowed under the components, Hard to understand, what is the truth?

All Comments

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Ela Posted on 2019-05-05

It should not be recommended to place a hole in the pad of the component. This will leak tin.
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Danny Posted on 2019-05-05

If there are more pins, this board may have to be a lot bigger.
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Koko Posted on 2019-05-05

Maybe for the convenience of testing
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Michelle Posted on 2019-05-05

It’s too absolute. Some components have relatively large power, and the bottom of the chip has a pad for heat dissipation. At the bottom of such a chip, the hole cannot be placed, and it will be short-circuited. In other cases, there is no such strict requirement.
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Cindy Posted on 2019-05-05

I suspect that it may be that some components are easily short-circuited when soldering some components (especially small patch components), and it is feared that the vias between the pads are also shorted together.
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Chole Posted on 2019-05-05

Make the hole into the window hole, the tin will not go up, naturally it will not be shorter with the surrounding pad.
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Jimmy Posted on 2019-05-05

Not absolute. There is not much relationship between the vias with smaller diameters on the pads.
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Mitra Posted on 2019-05-05

Do not place holes under the components as much as possible. This is considered from the EMC side. The vias will damage the ground below the components.
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