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About no holes are allowed under the components, what is the truth?

Development board
May 5, 2019 by Terry Wells 447

recently made a board, there are requirements to say: no holes are allowed under the components, Hard to understand, what is the truth?

All Comments

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Ela Posted on May 5, 2019

It should not be recommended to place a hole in the pad of the component. This will leak tin.
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Danny Posted on May 5, 2019

If there are more pins, this board may have to be a lot bigger.
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Koko Posted on May 5, 2019

Maybe for the convenience of testing
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Michelle Posted on May 5, 2019

It’s too absolute. Some components have relatively large power, and the bottom of the chip has a pad for heat dissipation. At the bottom of such a chip, the hole cannot be placed, and it will be short-circuited. In other cases, there is no such strict requirement.
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Cindy Posted on May 5, 2019

I suspect that it may be that some components are easily short-circuited when soldering some components (especially small patch components), and it is feared that the vias between the pads are also shorted together.
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Chole Posted on May 5, 2019

Make the hole into the window hole, the tin will not go up, naturally it will not be shorter with the surrounding pad.
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Jimmy Posted on May 5, 2019

Not absolute. There is not much relationship between the vias with smaller diameters on the pads.
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Mitra Posted on May 5, 2019

Do not place holes under the components as much as possible. This is considered from the EMC side. The vias will damage the ground below the components.

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